Salary is dependent on experience and education. Job Code: 25530 - 25537 Reports To: Production Manager Department Name: 160 – Mfg – Inspection - 2nd Optical FLSA Status: Non-Exempt Day shift: Monday-Friday 6:00am-2:30pm POSITION SUMMARY Use microscope equipment to perform visual inspection of die and other components by following standard and customized requirements per customer requests. Categorize defects follow standard or customized specification. KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE Level 1: Perform visual inspection on die based on commercial and military criteria per customer’s request. If discrepancies are found, initiate discrepancy report (DR) and turn them to DR coordinator. Track documents and jobs in real time basis and enter data into Epicor system. Ensure data recording on lot travelers is accurate. Understand the difference between Good and Reject die reporting, specify proper reject coding. Perform die sidewall inspection by following guidelines in specified criteria. Perform re-inspection job after discrepancy report released for low yield. Perform die plate monitor and inspection of die devices. Meet 95%+ yield requirement or better at QC sample inspection. Identify and report process deviations to supervisor. Meet quality goals, safety requirements, and follow company policies. Flexibility to perform other duties as assigned. Level 2: Perform visual inspection on die devices in compliance with military criteria. Back fill die on cavity that need to be reinspected, stack of waffle pack with good and bad dies and record in summary report before submitting job to Quality Control. Perform backside inspection based on customer specifications. Perform INP inspection on die based on INP criteria. Perform flip die in bump die per customer specifications. Meet or exceed daily output of 200 die per hour and 95%+ yield requirement or better at QC sample inspection. Identify and report process deviations to supervisor. Meet quality goals, safety requirements, and follow company policies. Flexibility to perform other duties as assigned. Level 3: Perform visual inspection of 100x or higher in magnifications for verification of defects of die devices. Understand many different rules and exceptions on different die devices for visual inspection. Understand all criteria both hermetic and non-hermetic for inspection. Perform visual inspection in device specifications to the GaAs visual document. Be able to identify different die devices by the string near the edge. Perform visual inspection back side and front side for Totsuka dies. Perform visual inspection & inking wafer to Totsuka. Use X-ray machine to handle die orientation for accuracy. Responsible to operate machine using Camtek tool for wafer inspection. Review defects found per customer specs. Understanding the editing and reclassification of wafers. Meet or exceed 95%+ yield requirement or better at QC sample inspection. Identify and report process deviations to supervisor. Meet quality goals, safety requirements, and follow company policies. Flexibility to perform other duties as assigned. Level 4: Perform visual inspection of 100x or higher in magnifications for verification of defects of die devices. Understand many different rules and exceptions on different die devices for visual inspection. Understand all criteria both hermetic and non-hermetic for inspection. Perform visual inspection in device specifications to the GaAs visual document. Be able to identify different die devices by the string near the edge. Use X-ray machine to handle die orientation for accuracy. Responsible to operate machine using Camtek tool for wafer inspection. Review defects found per customer specs. Understanding the editing and reclassification of wafers. Meet or exceed 95%+ yield requirement or better at QC sample inspection. Identify and report process deviations to supervisor. Meet quality goals, safety requirements, and follow company policies. Flexibility to perform other duties as assigned. Lead: Serve as back-up team leader and perform operator pass down at shift change. Responsible for inventory, material requests and hands-on job execution to ensure on time delivery. Verify machine setup and update department schedules. Provide on-the-job training for new operators. Flexibility to perform other duties as assigned. JOB REQUIREMENTS INCLUDE Education: High school diploma or equivalent required. Experience: Minimum one year experiencewith semiconductor production test. Knowledge/Skills: Familiar with procedure of wafer and die. Familiar with devices wafer, wafer maps, die location, multi-die ID, small and thin die, big die, bump die. Experience with hand tools such as tweezers, vacuum, pickup tools, die handling. SUPERVISORY RESPONSIBILITIES Total Number of Employees Directly Supervising: _0_ Number of Subordinate Supervisors Reporting to Position: _0_ This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified. In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will). PHYSICAL REQUIREMENTS INCLUDE In an average workday, employee must (check one frequency for each task): Task None Occasional Frequent Constant Stand ☐ ☐ ☐ ☒ Walk ☐ ☐ ☐ ☒ Sit ☐ ☐ ☒ ☐ Bend/stoop ☐ ☒ ☐ ☐ Climb ☐ ☒ ☐ ☐ Reach above shoulders ☐ ☒ ☐ ☐ Squat/crouch/kneel ☐ ☒ ☐ ☐ Push/pull ☐ ☐ ☒ ☐ Lift ☐ ☐ ☒ ☐ Usual amount ☐ Employee must use hands for repetitive action such as (please check all): Task Right Hand Left Hand Simple grasping ☒ Yes ☐ No ☐ Yes ☒ No Firm grasping ☐ Yes ☒ No ☐ Yes ☒ No Fine manipulation ☒ Yes ☐ No ☐ Yes ☒ No WORKING CONDITIONS INCLUDE In an average workday, employee is exposed to (check one frequency for each task): Task None Occasional Frequent Constant General shop conditions ☐ ☐ ☐ ☒ General office environment ☐ ☒ ☐ ☐ Humid, extreme hot/cold temps (non-weather) ☒ ☐ ☐ ☐ Outdoor weather conditions ☒ ☐ ☐ ☐ Fumes or airborne particles ☒ ☐ ☐ ☐ Fluorescent lights ☐ ☐ ☒ ☐ Moving, mechanical parts ☐ ☒ ☐ ☐ Toxic chemicals ☒ ☐ ☐ ☐ Loud noise intensity levels ☒ ☐ ☐ ☐ Risk of electrical shock ☐ ☐ ☒ ☐ Travel for job ☒ ☐ ☐ ☐